Etching liquid composition

ABSTRACT

The invention provides etching liquid compositions for transparent conducting films wherein foaming is suppressed and residues do not occur after etching. The etching liquid compositions include an etching liquid for transparent conducting films and one or more compounds selected from the group consisting of polysulfonic acid compounds and polyoxyethylene-polyoxypropylene block copolymers.

RELATED APPLICATIONS

This application claims priority under 35 U.S.C. §119 from Japanapplication no. 2000-272528, filed Sep. 8, 2000.

FIELD OF THE INVENTION

The present invention relates to an etching liquid for transparentelectrode films of LCDs and other display elements.

BACKGROUND OF THE INVENTION

While indium tin oxide, indium oxide, tin oxide, zinc oxide, etc. areall used as transparent electrodes of LCDs and electroluminescentdisplay elements, indium tin oxide (called ITO hereinafter) is mainlyused for this purpose. Examples of conventional etching liquids forITO-films are 1. aqueous solutions of iron (III) chloride, 2. aqueoussolutions of iodic acid, 3. aqueous solutions of phosphoric acid, 4.mixed solutions of hydrochloric acid and nitric acid (aqua regia), 5.aqueous solutions of oxalic acid, etc. However, these etching liquidsare not adequate for practical use because of the following problems:

1. Aqueous solutions of iron (III) chloride are inexpensive and have ahigh etching speed; however, they have the disadvantage that with thesesolutions the amount of side-etching is high and that they contain Fewhich has a negative influence on semiconductors.

2. With aqueous solutions of iodic acid, which have good etchingcharacteristics, the amount of side-etching is low; however, in additionto being expensive, they lack stability because iodine is easilyreleased.

3. Aqueous solutions of phosphoric acid, in addition to etching Al usedon wiring, have the disadvantage that a residue remains after etching.

4. Mixed solutions of hydrochloric acid and nitric acid (aqua regia)change rapidly over time, making process control difficult and deliveryimpossible.

5. Aqueous solutions of oxalic acid have many advantages such asexcellent stability, low cost, and the fact that they do not etch Al,etc.; however, a residue remains after etching with these solutions.

Regarding the residues which occur when using an aqueous solution ofoxalic acid, JP, A, 7-141932 discloses a technique for reducing theresidues by using dodecylbenzene-sulfonic acid; however, this has thedisadvantage of intense foaming.

Moreover, the process of forming a silicon nitride film etc. on a glasssubstrate and forming ITO film thereon is examined in these years, andthe structure of the element is changing. Therefore, removing propertyof the residue is becoming insufficient.

SUMMARY OF THE INVENTION

Thus, it is an object of the present invention to solve theabove-mentioned problems of the prior art and to provide an etchingliquid for transparent conducting films wherein foaming is suppressedand residues do not occur after etching.

By conducting extensive studies, the inventors of the present inventionhave discovered that the above-mentioned problems can be solved byincluding a polysulfonic acid compounds and a specific surfactant in anetching liquid for transparent conducting films and, as a result offurther research, have completed the present invention.

One aspect of the present invention relates to an etching liquidcomposition comprising an etching liquid for transparent conductingfilms and one or more compounds selected from the group consisting ofpolysulfonic acid compounds and polyoxyethylene-polyoxypropylene blockcopolymers.

Another aspect of the present invention relates to the before-mentionedcomposition wherein the transparent conducting film is an indium tinoxide (ITO) film.

The present invention, in some aspects, also relates to thebefore-mentioned compositions wherein the etching liquid for transparentconducting films is an aqueous solution of oxalic acid.

The present invention, in other aspects, further relates to thebefore-mentioned compositions wherein the concentration of the one ormore compounds selected from the group consisting of polysulfonic acidscompounds and polyoxyethylene-polyoxypropylene block copolymers is inthe range from 0.0001 to 10 mass percentages.

In yet other aspects, the present invention relates to thebefore-mentioned compositions wherein polysulfonic acids compounds areone or more compounds selected from the group consisting of naphthalenesulfonic acid-formaldehyde condensates and their salts, polystyrenesulfonic acids and their salts, and lignosulfonic acids and their salts.

In further aspects of the invention, the present invention relates tothe before-mentioned compositions further comprising a sulfonate typeanionic surfactant.

The present invention, in still further aspects, also relates to thebefore-mentioned compositions further comprising water-soluble loweralcohols.

In additional aspects, the present invention further relates to thebefore-mentioned composition wherein water-soluble lower alcohols areone or more compounds selected from the group consisting of methanol,ethanol, n-propanol, isopropanol and n-butanol.

In still further aspects, the present invention also relates to thebefore-mentioned compositions wherein the concentration of water-solublelower alcohols is in the range from 1 to 10 mass percentages.

According to the present invention, it has been found thatpolyoxyethylene-polyoxypropylene block copolymers have the effect ofremoving the residues remaining after etching an ITO-film and,surprisingly, that by combining polyoxyethylene-polyoxypropylene blockcopolymers with polysulfonic acids compounds and a sulfonate typeanionic surfactant the residue removing effect is greatly increased. Ithas further been found that polyoxyethylene-polyoxypropylene blockcopolymers and water-soluble alcohols have the effect of suppressing thefoaming caused by sulfonate type anionic surfactants.

BEST MODES FOR CARRYING OUT THE INVENTION

Below, the best modes for carrying out the invention will be describedin detail.

Firstly, the concentration of the oxalic acid used in the presentinvention is set in a range in which crystals are not precipitated andin which the etching speed is sufficient. With a concentration of 0.1mass percentages or less of oxalic acid the etching speed at 50° C. is100 Å/min. or less, which is not sufficient for practical use. With aconcentration of 10 mass percentages or more precipitation of crystalsoccurs at 25° C. or less, which causes problems with regard to shelflife and delivery. Particularly preferred concentrations are in therange from 0.5 to 5 mass percentages.

The polysulfons used in the present invention are high molecularcompounds such as naphthalene sulfonic acid-formaldehyde condensates andtheir salts, polystyrene sulfonic acids and their salts, lignosulfonicacids and their salts, polyethylene sulfonic acids and their salts,etc.; and aromatic polysulfonic acids such as 1,5-naphthalene-disulfonicacid, 1-naphthol-3, 6-disulfonic acid, etc, and their salts. Among thesenaphthalene sulfonic acid-formaldehyde condensates and their salts,polystyrene sulfonic acids and their salts and lignosulfonic acids andtheir salts, are particularly preferred.

Naphthalene sulfonic acid-formaldehyde condensates and their salts arecommercially available under trade names such as Polystar NP-100 (ofNippon Oil & Fats Co.,Ltd.), Runox 1000, 1000C, 1500A (of Toho ChemicalIndustry Co., Ltd.), Ionet D-2, Sanyo Levelon PHL (of Sanyo ChemicalIndustries, Ltd.), Loma PWA-40 (of Sannopku Co., Ltd.), Demol N, DemolAS (of KAO Soap Co., Ltd.), etc. Loma PWA-40 and Demol AS, which areammonium salts and free acids, are especially preferred. Polystyrenesulfonic acids and their salts and lignosulfonic acids and their saltsare commercially available as sodium salt under the trade names ofPolity 1900 (of Lion Corporation) and Sorpol 9047K (of Toho ChemicalIndustry Co., Ltd.) respectively. For applications in the electronicsindustry sodium and other metals are not desirable; however, thesesodium salts can be used if the sodium is removed by a treatment with anion exchange resin etc.

The polyoxyethylene-polyoxypropylene block copolymers used in thepresent invention not only have, by themselves, the effect of reducingthe residues remaining after etching an ITO-film, but in addition tothese removal properties which are greatly improved by combining themwith the before-mentioned polysulfonic acid compounds, they also havethe effect of reducing foaming. A great number ofpolyoxyethylene-polyoxypropylene block copolymers with differentmolecular weights and different proportions of polyoxyethylene topolyoxypropylene is commercially available from surfactantmanufacturers. There are, e.g., those of the Newpol PE-Series (PE-61,62, 64, 68, 71, 74, 75, 78, 108, 128) from Sanyo Chemical IndustriesCo.,Ltd. and those of the Epan-Series (Epan 410, 420, 450, 485, 710,720, 740, 750, 785) from Daiichi Pharmaceutical Co.,Ltd. etc. Copolymerswith a high proportion of polyoxypropylene, i.e. 80 to 90 masspercentages, have good defoaming properties, while copolymers with 50mass percentages or more of polyoxyethylene are good for removing theresidues remaining after etching.

Examples of sulfonate type anionic surfactants used in the presentinvention are alkyl benzene sulfonic acids such as dodecylbenzenesulfonic acid and their salts, alkyl sulfate esters and their salts,dialkyl esters of sulfosuccinic acids and their salts, polyoxyethylenealkyl ether sulfonic acids and polyoxyethylene allyl ether sulfonicacids and their salts, etc. Among these polyoxyethylene alkyl ethersulfonic acids and polyoxyethylene allyl ether sulfonic acids and theirsalts are particularly preferred because their foaming is relativelyinsignificant. These are commercially available under trade names suchas Newcol 560SF, Newcol 707SF from Nippon Nyukazai Co.,Ltd. and NissanAvanel S-Series from Nippon Oil & Fats Co.,Ltd. etc. These sulfonatetype anionic surfactants, similar to the polysulfonic acid compoundsmentioned before, have the ability to remove etching residues; however,due to their foaming properties they are not sufficient on their own. Inorder to suppress foaming water-soluble lower alcohols may be added. Aswater-soluble lower alcohol methanol, ethanol, n-propanol, isopropanol,n-butanol, etc. can be used. Preferably, the concentration ofwater-soluble lower alcohols is in the range from 1 to 10 masspercentages. If the concentration is low, the use effect cannot beobtained, while swelling of the resist and other problems occur if theconcentration is too high.

The concentration of these polysulfonic acid compounds, sulfonate typeanionic surfactants and polyoxyethylene-polyoxypropylene blockcopolymers is in the range from 0.0001 to 10 mass percentages, andpreferably in the range from 0.001 to 10 mass percentages. Whencombining polysulfonic acid compounds andpolyoxyethylene-polyoxypropylene block copolymers, the polysulfonic acidcompounds are in the range from 0.001 to 10 mass percentages and thepolyoxyethylene-polyoxypropylene block copolymers are in the range from0.0001 to 1 mass percentages. The polysulfonic acids compounds and thepolyoxyethylene-polyoxypropylene block copolymers can be freelyproportioned within these concentration ranges. If the concentration ofpolysulfonic acid compounds, sulfonate type anionic surfactant andpolyoxyethylene-polyoxypropylene block copolymers is low, the residueremoving effect is not sufficient, and if the concentration is too high,a proportionate effect cannot be expected. It is necessary to properlyselect these compounds depending upon the material of substrates of ITOfilm. For example, on glass substrates, polysulfonic acid compounds havetheir effect at 0.001 to 0.1 mass percentages, but, on silicon nitridefilms, they have their effect only when the concentration is raised to0.1 to 10 mass percentages.

Below Examples of the present invention are given together withComparative Examples in order to describe the present invention ingreater detail, without, however, limiting it to these Examples.

EXAMPLES

Table 1 shows etching liquids according to the present inventiontogether with etching liquid composition given for the purpose ofcomparison.

TABLE 1 Sulfonate type Polyoxyethylene- Oxalic acid Polysulfonic acidanionic polyoxypropylene Water-soluble (mass %) compounds surfactantblock copolymers alcohol Comparative 3.4 Example 1 Comparative 3.4dodecylbenzene Example 2 -sulfonic acid 0.03 mass % Example 1 3.4 Polity1900 0.1 mass % Example 2 3.4 Demol AS 0.1 mass % Example 3 3.4 Sorpol9047K 0.1 mass % Example 4 3.4 Epan 485 0.001 mass % Example 5 0.5Polity 1900 0.01 mass % Example 6 5.0 Polity 1900 0.1 mass % Example 73.4 Polity 1900 Epan 785 0.001 mass % 0.01 mass % Example 8 3.4 Polity1900 Epan 785 0.01 mass % 0.01 mass % Example 9 3.4 Sorpol 9047K Epan785 0.1 mass % 0.1 mass % Example 10 3.4 Demol AS Epan 485 0.01 mass %0.01 mass % Example 11 3.4 Newcol 707SF Epan 710 methanol 0.03 mass %0.005 mass % 10 mass % Example 12 3.4 Newcol 707SF Epan 710 2-propanol0.03 mass % 0.005 mass % 10 mass % Example 13 3.4 Newcol 707SF Epan 710n-butanol 0.03 mass % 0.005 mass % 5 mass % Example 14 3.4 Polity 190010.0 mass % Example 15 3.4 Demol AS 1.0 mass % Notes: Water was added tomake up a total mass of 100. Polity 1900: polystyrene sulfonate sodiumsalt manufactured by Lion Corporation. Sorpol 9047K: lignosulfonic acidsodium salt manufactured by Toho Chemical Industry Co., Ltd. Demol AS:ammonium salt of naphthalene sulfonate-formalin condensates manufacturedby KAO Soap Co., Ltd. Newcol 707SF: ammonium salt of specialpolyoxyethylene allyl sulfonate ammonium salt manufactured by NipponNyukazai Co., Ltd. Epan 485, 710, 785: polyoxyethylene-polyoxypropyleneblock copolymers manufactured by Daiichi Pharmaceutical Co., Ltd.

Regarding the etching liquids shown above, the following items wereinvestigated:

(Foaming—Foam Height—)

A test sample of 20 ml was introduced into a 100 ml calorimetric tubewhich was set in a TS-type shaker and shaken for 2 minutes. Foaming wasevaluated by measuring the foam height 30 seconds and again 5 minutesafter the shaking had stopped.

(Etching Speed)

A substrate on which a resist pattern had been formed on a 1500 Å thickamorphous ITO-film was submerged for 1 minute in an etching liquid witha temperature of 50° C., and after rinsing and drying the substrate andstripping the resist mask, the amount of etching was measured with atracer film thickness meter.

(Etching Residues)

1. The residues remaining after etching a glass substrate on which anITO-film had been formed for 1.8 times the just etching time calculatedfrom the etching speed were evaluated by electron microscopeobservation.

2. The residues remaining after etching a glass substrate on which firsta silicon nitride film and then an ITO-film had been formed for 1.8times the just etching time calculated from the etching speed wereevaluated by electron microscope observation.

The results are shown in Table 2.

TABLE 2 Residues Foaming (foam remaining height) in mm Etching speedafter etching after 30 sec. after 5 min. in Å/min. 1 2 Comparative 0 01350 x x Example 1 Comparative 180  160  1320 + x Example 2 Example 1 00 1320 ∘ Example 2 0 0 1300 ∘ ∘ Example 3 6 0 1350 ∘ ∘ Example 4 5 01320 ∘ Example 5 0 0  650 ∘ Example 6 0 0 1400 ∘ Example 7 9 0 1350 +Example 8 5 0 1320 + Example 9 6 0 1350 + ∘ Example 10 4 0 1300 +Example 11 20  7 1290 ∘ Example 12 0 0 1360 ∘ Example 13 30  1 1350 ∘Example 14 4 0 1350 ∘ + Example 15 3 0 1320 ∘ + Evaluation of residues:x: great many residues over the whole surface ∘: few residues +: noresidues at all

Those skilled in the art will recognize, or be able to ascertain usingno more than routine experimentation, many equivalents to the specificembodiments of the invention described herein. Such equivalents areintended to be encompassed by the following claims.

1. An etching liquid composition comprising an etching liquid, which isan aqueous solution of oxalic acid for transparent conducting films,polysulfonic acid compounds and water, and optionallypolyoxyethylene-polyoxypropylene block copolymers, a sulfonate typeanionic surfactant and/or water-soluble lower alcohols.
 2. Thecomposition according to claim 1 wherein the transparent conducting filmis an indium tin oxide (ITO) film.
 3. The composition according to claim1 wherein the concentration of the polysulfonic acid compounds and theoptional polyoxyethylene-polyoxypropylene block copolymers is in therange from 0.0001 to 10 mass percentages.
 4. The composition accordingto claim 1 wherein polysulfonic acids compounds are one or morecompounds selected from the group consisting of naphthalene sulfonicacid-formaldehyde condensates and their salts, polystyrene sulfonicacids and their salts, and lignosulfonic acids and their salts.
 5. Thecomposition according to claim 1 wherein the water-soluble loweralcohols are one or more compounds selected from the group consisting ofmethanol, ethanol, n-propanol, isopropanol and n-butanol.
 6. Thecomposition according to claim 1 wherein the concentration of thewater-soluble lower alcohols is in the range from 1 to 10 masspercentages.